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  • APEC 2026 Download – Highlighting Evolving Landscape of Power Electronics

    Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95053

    Join us at Santa Clara University for the APEC 2026 Download Event, hosted by the IEEE PELS San Francisco Bay Area Chapter. This engaging session brings together engineers, researchers, and industry professionals to explore the most impactful moments and innovations presented at the Applied Power Electronics Conference (APEC) 2026. The event will highlight key takeaways […]

  • Quarterly social meeting and program

    Bldg Livermore, CA, United States

    Reserve this date for a social gathering and a program of general interest to be determined. IEEE member fee is subsidized. Agenda: Social meeting, presentation, and lunch. Select from buffet or order from menu depending on the number of registrations. Bldg: Golf course restaurant, not pro shop, Beeb's Sports Bar and Grill, 915 Club House […]

  • Diamond Semiconductor Device Design & Fabrication

    Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051

    Diamond Semiconductor Device Design & Fabrication [] Abstract: Diamond Quanta: making diamond as available as silicon Speaker: Adam Khan Founder & CEO Diamond Quanta AGENDA: Thursday April 23, 2026 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Please register on Eventbrite before 9:30 AM on Thursday April 23, 2026 $4 IEEE members […]

  • SCV-EPS AdCom Meeting (APRIL 2026)

    Virtual: https://events.vtools.ieee.org/m/549396

    Monthly AdCom meeting: 1. Welcome - Hualiang 2. Symposium status update - Annette/Paul/Hualiang 3. Education outreach status - Masha/Azmat/Hualiang 4. Chapter Storage - Hualiang XXXX NOT 5. Monthly talk preparation - Chandan/Luu 6. Chapter website update - XXXX NOT Venkatesh/Claire/Paul 7. Senior member advancement - Dwayne Xxxx NOT 8: Election 2026 9: Open discussion - […]

  • Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing

    Virtual: https://events.vtools.ieee.org/m/546237

    []Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve […]

  • From Process to Performance: Challenges in uOLED and uLED Electronics Manufacturing

    Virtual: https://events.vtools.ieee.org/m/533601

    As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]

  • The Intelligence of the Machine.. The Rigor of the Road!!

    SEMI, 673 S Milpitas Blvd, Milpitas, California, United States, 95035

    IEEE Event Agenda - Tuesday May 12, 2026 🔹 5:00 PM – 5:30 PM Registration, Refreshments, Food & Networking (Meet & Greet) Featured Speakers & Sessions 🔹 5:30 PM – 6:15 PM Topic 1: Industry Talk – Standardizing Automotive Firmware for SDVs Experts from Mercedes-Benz, Arm, and Athos Silicon will discuss the urgent need for […]

  • Spring Speaker Series 3

    Stanford, California, United States, 94305

    Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

  • Third Annual IEEE Build-Up Substrate Symposium

    Samsung San Jose, CA, United States

    [] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]

  • IEEE Build-Up Substrate Symposium (BUSS)

    location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352

    We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]

  • IEEE Canada Blockchain Forum 2026 (4th edition)

    Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7

    The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum […]

  • Center for Advanced Signal and Image Sciences (CASIS) 29th Annual Workshop

    Bldg: Building 661 L-794, University of California Livermore Collaboration Center, 7000 East Ave, Livermore, California, United States, 94550

    We are thrilled to host LLNL’s 30th Center for Advanced Signal and Image Sciences (CASIS) workshop. The workshop returns with a full 2-day in-person schedule on Wednesday and Thursday, June 24-25, 2026. We encourage a broad range of technical topics at the workshop and being non-archival apart from original work, we are also considering intermediate […]