Speaker(s): Roberto Morabito, Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95054, Virtual: https://events.vtools.ieee.org/m/539764
**TALK LOGISTICS:** Monday, March 23, 2026 (remote speaker, audience can be either in person or remote on Zoom. Please RSVP and indicate if you will be local or remote) 6:30 registration, food sponsored by Neo4j, networking. Neo4j contacts will be attending. 7:00 SFbayACM upcoming events, introduce the speaker 7:10 to 8:15 or 8:30 based on […]
**TALK LOGISTICS:** Monday, March 23, 2026 (remote speaker, audience can be either in person or remote on Zoom. Please RSVP and indicate if you will be local or remote) 6:30 registration, food sponsored by Neo4j, networking. Neo4j contacts will be attending. 7:00 SFbayACM upcoming events, introduce the speaker 7:10 to 8:15 or 8:30 based on […]
[]Co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) such as the photodiode laser, etc. and the electrical engine (EE) which consists of the electronic ICs (EIC) such as the laser driver, transimpedance amplifier, etc. as well as the switch ASIC (application specific IC). […]
Hike at Green Belt Trail Hayward, California, United States
Synopsis: Please feel free to check out the work and thoughts of Prof. Ethem Alpaydın, Ph.D., https://mitpress.mit.edu/author/ethem-alpaydn-10375/ on Google Scholar at https://scholar.google.com/scholar?hl=en&as_sdt=0%2C5&q=%22Ethem+Alpayd%C4%B1n%22&btnG=, and generally on the Internet. Then, please feel free to submit your questions to Prof. Ethem Alpaydın - via Twitter by using the hashtag #ProfAlpaydinAMA and tagging @vishnupendyala - emailing vspendyala(at)hotmail(dot)com with #ProfAlpaydinAMA […]
Continuation of Stanford IEEE Speaker Series Stanford, California, United States, 94305
[]Chiplets have become a compelling approach to scaling and heterogeneous integration e.g. integrating workload-specific processors and massive bandwidth memory systems into computing systems; integrating die from multiple function-optimized process nodes into one product; integrating silicon from multiple businesses into one product. Chiplet-based products have been produced in high volume by multiple companies using proprietary chiplet […]
Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305
As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]
Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305
[] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]
