Events

[]Chiplets have become a compelling approach to scaling and heterogeneous integration e.g. integrating workload-specific processors and massive bandwidth memory systems into computing systems; integrating die from multiple function-optimized process nodes into one product; integrating silicon from multiple businesses into one product. Chiplet-based products have been produced in high volume by multiple companies using proprietary chiplet […]

Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]

Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

[] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]