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  • Leadership Hike

    Hayward 6000 California City Blvd, California City, CA, United States

    Hike at Green Belt Trail Hayward, California, United States

  • AMA (Ask me Anything) with Prof. Ethem Alpaydın

    Virtual: https://events.vtools.ieee.org/m/537179

    Synopsis: Please feel free to check out the work and thoughts of Prof. Ethem Alpaydın, Ph.D., https://mitpress.mit.edu/author/ethem-alpaydn-10375/ on Google Scholar at https://scholar.google.com/scholar?hl=en&as_sdt=0%2C5&q=%22Ethem+Alpayd%C4%B1n%22&btnG=, and generally on the Internet. Then, please feel free to submit your questions to Prof. Ethem Alpaydın - via Twitter by using the hashtag #ProfAlpaydinAMA and tagging @vishnupendyala - emailing vspendyala(at)hotmail(dot)com with #ProfAlpaydinAMA […]

  • Heat-Assisted Magnetic-Recording: Characterization of Media Properties

    Quadrant Corp., 1120 Ringwood Ct., San Jose, California, United States, 95131, Virtual: https://events.vtools.ieee.org/m/544920

    Pierre-Olivier Jubert of Western Digital will review the design and characterization of media used in heat-assisted magnetic recording (HAMR). Speaker(s): Pierre-Olivier, Agenda: 6:30 – 7:00 Socializing and Networking at Quadrant 6:55 Zoom session will be online with Waiting Room 7:00 – 7:45 Lecture begins, online and in person 7:45 – 8:00 Questions and Answers Quadrant […]

  • Spring Speaker Series Start

    Stanford, California, United States, 94305

    Continuation of Stanford IEEE Speaker Series Stanford, California, United States, 94305

  • Using Architectural Simulation to Investigate Chiplets for Scalable and Cost Effective HPC Beyond Exascale

    Virtual: https://events.vtools.ieee.org/m/539463

    []Chiplets have become a compelling approach to scaling and heterogeneous integration e.g. integrating workload-specific processors and massive bandwidth memory systems into computing systems; integrating die from multiple function-optimized process nodes into one product; integrating silicon from multiple businesses into one product. Chiplet-based products have been produced in high volume by multiple companies using proprietary chiplet […]

  • Conversational AI: Practical Challenges in Talking to People

    925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/541387

    This is a hybrid in-person and online event. Pre-registration is required for either. Conversational AI systems today speak with remarkable confidence, often giving the impression of understanding and reasoning. However, teams deploying these systems often quickly encounter familiar problems: drift, hallucinations, contradictory answers, and conversations that quietly lose their original purpose. Why do systems that […]

  • Spring Speaker Series 2

    Stanford, California, United States, 94305

    Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

  • Quarterly social meeting and program

    Bldg Livermore, CA, United States

    Reserve this date for a social gathering and a program of general interest to be determined. IEEE member fee is subsidized. Agenda: Social meeting, presentation, and lunch. Select from buffet or order from menu depending on the number of registrations. Bldg: Golf course restaurant, not pro shop, Beeb's Sports Bar and Grill, 915 Club House […]

  • From Process to Performance: Challenges in uOLED and uLED Electronics Manufacturing

    Virtual: https://events.vtools.ieee.org/m/533601

    As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]

  • Spring Speaker Series 3

    Stanford, California, United States, 94305

    Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

  • Third Annual IEEE Build-Up Substrate Symposium

    Samsung San Jose, CA, United States

    [] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]

  • IEEE Build-Up Substrate Symposium (BUSS)

    location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352

    We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]

  • IEEE Canada Blockchain Forum 2026 (4th edition)

    Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7

    The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum […]