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  • THE INTELLIGENCE OF THE MACHINE. THE RIGOR OF THE ROAD!!

    SEMI Headquarters 673 South Milpitas Blvd.,, Milpitas, CA

    This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack. Who Should Attend: Automotive engineers and architects Safety and cybersecurity specialists Semiconductor and embedded systems professionals Researchers in autonomous vehicles and AI safety Technical decision-makers from OEMs and suppliers […]

  • Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing

    Virtual: https://events.vtools.ieee.org/m/546237

    []Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve […]

  • From Process to Performance: Challenges in uOLED and uLED Electronics Manufacturing

    Virtual: https://events.vtools.ieee.org/m/533601

    As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]

  • The Intelligence of the Machine.. The Rigor of the Road!!

    SEMI, 673 S Milpitas Blvd, Milpitas, California, United States, 95035

    IEEE Event Agenda - Tuesday May 12, 2026 🔹 5:00 PM – 5:30 PM Registration, Refreshments, Food & Networking (Meet & Greet) Featured Speakers & Sessions 🔹 5:30 PM – 6:15 PM Topic 1: Industry Talk – Standardizing Automotive Firmware for SDVs Experts from Mercedes-Benz, Arm, and Athos Silicon will discuss the urgent need for […]

  • Spring Speaker Series 3

    Stanford, California, United States, 94305

    Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

  • Closing the Loop: Using Comp Vision to Auto PCB E-Waste Sorting (Student Proj)

    Valley Research Park 319 N Bernardo Ave, Mountain View, CA, United States

    **TALK LOGISTICS:** Monday, May 18, 2026 (remote speaker, audience can be either in person or remote on Zoom. Please RSVP and indicate if you will be local or remote) 6:30 registration, food sponsored by Neo4j, networking. 7:00 SFbayACM upcoming events, introduce the speaker 7:10 to 8:15 or 8:30 based on Q and A - presentation […]

  • Closing the Loop: Using Comp Vision to Auto PCB E-Waste Sorting (Student Proj)

    Valley Research Park 319 N Bernardo Ave, Mountain View, CA, United States

    **TALK LOGISTICS:** Monday, May 18, 2026 (remote speaker, audience can be either in person or remote on Zoom. Please RSVP and indicate if you will be local or remote) 6:30 registration, food sponsored by Neo4j, networking. 7:00 SFbayACM upcoming events, introduce the speaker 7:10 to 8:15 or 8:30 based on Q and A - presentation […]

  • Third Annual IEEE Build-Up Substrate Symposium

    Samsung San Jose, CA, United States

    [] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]

  • IEEE Build-Up Substrate Symposium (BUSS)

    location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352

    We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]

  • IEEE Canada Blockchain Forum 2026 (4th edition)

    Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7

    The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum […]

  • Latest & Unique Tech Innovations from the 2026 Consumer Electronics Show (CES) 

    Valley Research Park 319 N Bernardo Ave, Mountain View, CA, United States

    LOCATION ADDRESS (Hybrid, in person or by zoom, you choose) Valley Research Park 319 North Bernardo Avenue Mountain View, CA CA 93043 If you want to join remotely, you can submit questions via Zoom Q&A. The zoom link: (https://acm-org.zoom.us/j/99320216248?pwd=hmIZXJbNiS0F4hrJerx0ffnI8rbYOr.1) Join via YouTube: https://youtube.com/live/sJ38lsfLfeU AGENDA 6:30 Door opens, SFBAY ACM 69 anniversary Cake and networking (we […]

  • Center for Advanced Signal and Image Sciences (CASIS) 29th Annual Workshop

    Bldg: Building 661 L-794, University of California Livermore Collaboration Center, 7000 East Ave, Livermore, California, United States, 94550

    We are thrilled to host LLNL’s 30th Center for Advanced Signal and Image Sciences (CASIS) workshop. The workshop returns with a full 2-day in-person schedule on Wednesday and Thursday, June 24-25, 2026. We encourage a broad range of technical topics at the workshop and being non-archival apart from original work, we are also considering intermediate […]

  • Multi-Agent Systems at Scale as a Shared Platform for the enterprises

    Valley Research Park 319 N Bernardo Ave, Mountain View, CA, United States

    AI Agent Infrastructure as a Shared Platform: Patterns for Multi-Agent Systems at Scale for the enterprise. LOCATION ADDRESS (Hybrid, in person or by zoom, you choose) Valley Research Park 319 North Bernardo Avenue Mountain View, CA CA 93043 Don't use the front door. When facing the front door, turn right along the front of the […]