Workshop: Decoding AI Hardware – Materials, Metrology, and Failure Analysis in Advanced Packaging
Four guided training talks with small-group interaction: 9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis 9:30: Metal TIM and Low-Temp Solder Paste for HPC & AI Industry Challenges 10:30: Failure Analysis of Electronic Components for AI and Data Center Infrastructure 11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force […]