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  • Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing

    Virtual: https://events.vtools.ieee.org/m/546237

    []Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve […]

  • From Process to Performance: Challenges in uOLED and uLED Electronics Manufacturing

    Virtual: https://events.vtools.ieee.org/m/533601

    As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: […]

  • Spring Speaker Series 3

    Stanford, California, United States, 94305

    Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

  • Third Annual IEEE Build-Up Substrate Symposium

    Samsung San Jose, CA, United States

    [] (More information will be added in early March. General Registration should open around March 1st. Sponsors may register at the link below.) We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced […]

  • IEEE Build-Up Substrate Symposium (BUSS)

    location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352

    We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based […]

  • IEEE Canada Blockchain Forum 2026 (4th edition)

    Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7

    The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum […]