The power industry is under pressure to rapidly expand infrastructure to meet growing demands from both consumers and producers. But sticking to traditional design and construction methods may no longer be enough. One of the biggest bottlenecks? Hardware dependencies—like waiting on control wiring or specific components—that delay commissioning and inflate project timelines. This presentation explores […]

[]Trends in consumer goods are leaning towards thinner, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight, portable, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that […]

[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models […]

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such […]

[] Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically […]