Events

Drawn from launch-readiness work in medical device product development, this talk covers how to hold scope when capable teams push to expand it, how to surface trade-offs so groups reach decisions themselves, and how to escalate without damaging the relationships you depend on. Speaker(s): Isha Sharma, Room: 108, Bldg: Alameda Hall, Santa Clara University, Santa […]

[]This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven […]

Session 3: (https://ieee-climatechain-hack.devpost.com/) Join us for Session 3 of the Learning & Training Series for the IEEE Global ClimateChain Hackathon 2026, a global initiative bringing together students, researchers, developers, industry professionals, and innovators to explore how Artificial Intelligence, Blockchain, and emerging technologies can support climate action and sustainability. This session will focus on Ethics, Responsibility […]

Part of the 11th ACM/IEEE Symposium on Edge Computing (SEC 2026) Location: Santa Clara University | Date: Oct 13-15, 2026 Overview The future of the Edge is not just decentralized—it must be sustainable. As AI models grow in complexity, the environmental and energetic costs of deploying them on edge devices have become a critical bottleneck. […]

ACM/IEEE SEC 2026 and the 14th IEEE International Conference on Cloud Engineering (IC2E 2026) will be held together at Santa Clara University. Attendees may participate in technical sessions from either conference, and both communities will come together for a joint poster and demo session. SEC is a forum for top researchers, engineers, students, entrepreneurs, and […]

This is an online event. Pre-registration is required. Trusted adoption of an AI solution in an enterprise setting has many requirements. Large Language Models (LLMs) can often be constrained by the risks of hallucination bias and limited operational trust and reliability. Overcoming these challenges requires models whose output is fully grounded, auditable, and accurate. In […]

IEEE OEB-LMAG, 4Q26 Meeting Visit both the USS Hornet and CA Historical Radio Society Museum! This is one meeting you won’t want to miss! Wednesday, October 14, 2026 (11:50 AM to 2:30 PM PDT) The Oakland East Bay Life Members Affinity Group (OEB LMAG) is hosting an excursion to two historical locations in Alameda CA, […]

*****This vTools link is for purchase of Vendor Tables ONLY! No walk-in registrations.***** (Limit of 10 vendor tables so do not delay!) Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request. For more than one (1) attendee to support the table, […]

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, […]

Materials Science for Quantum Computing Abstract: Quantum technologies have made remarkable advances in recent years, but moving from laboratory demonstrations to useful, large-scale systems remains a formidable engineering challenge. Whether the platform is based on superconducting circuits, semiconductor spins, atoms, ions, or photons, performance and scalability depend critically on materials quality, interfaces, defect control, process […]

TBD Power system models are essential for planning, analysis, and operational studies, but a model that reproduces a measured response is not necessarily a meaningful model. This presentation examines what makes a power system model meaningful in practice, drawing on extensive experience in model development, parameterization, validation, field testing, and application of generic and vendor-specific […]

Four guided training talks with small-group interaction: 9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis 9:30: Metal TIM and Low-Temp Solder Paste for HPC & AI Industry Challenges 10:30: Failure Analysis of Electronic Components for AI and Data Center Infrastructure 11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force […]

IEEE Global and SCV-OEB SSIT Chapter: Diffie-Hellman Key Exchange 50th Anniversary Global Celebration Drs. Diffie and Hellman, recipients of the 2015 ACM A.M. Turing Award, will be joining us in person. The day will honor what their work made possible and look ahead to the next 50 years of digital public infrastructure. IEEE members and […]

[]This 2-day symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, stress levels, mechanisms, testing schemes, accelerated testing, and environmental stresses. The intent is to bring together electrical, reliability, materials, […]

The rapid deployment of AI-optimized data centers is introducing electrical load behaviors that differ significantly from traditional IT facilities. AI workloads exhibit high power density, fast transient demand, and large step changes in active power associated with training and inference cycles, creating new challenges for power system stability and protection. In parallel, the growing adoption […]