Agentic AI systems combine autonomy with real-world tool use, offering transformative potential but also introducing novel risks. This talk will introduce agentic AI and outline key vulnerabilities, including jailbreaks, tool hijacking, model misuse, and indirect exploitation through prompt injection. It will then focus on security risks associated with the Model Context Protocol (MCP) and conclude […]

[](to be provided -- please check back) Speaker(s): Tae-Kyu Lee, Virtual: https://events.vtools.ieee.org/m/501073

[] CYBERSECURITY AWARENESS MONTH Cybersecurity Starts with You: Protect, Prevent, Prevail Since 2004, the President of the United States and Congress have declared October to be Cybersecurity Awareness Month. Cyber-attacks on corporations, governmental agencies and individuals are becoming increasingly widespread and regular, as well as more complex. The Virtual Sixth Annual Los Angeles IEEE Coastal […]

Achieving efficient p-type doping in gallium nitride (GaN) and its alloys remains one of the most critical challenges in realizing the full potential of III-nitride semiconductors for high-power electronics, deep-ultraviolet (DUV) optoelectronics, and quantum information technologies. While magnesium is the conventional acceptor dopant, its high ionization energy (≈0.22 eV in GaN and up to 0.6 […]

Free Registration (with a Zoom account; you can get one for free if you don't already have it. This requirement is to avoid Zoom bombing. Please sign in using the email address tied to your Zoom account — not necessarily the one you used to register for the event.): https://sjsu.zoom.us/meeting/register/qGy644m7StmKMra3Xs_x2g Synopsis: Please feel free to […]

Rethinking Chip Design to deliver Faster, Smarter, More Compact Solutions [] Abstract: CDimension is rethinking chip design from the ground up, delivering solutions that are faster, smarter, and more compact. We’re moving beyond the limitations of traditional technology. Our foundational innovations in advanced materials and semiconductor integration unlock unprecedented gains in performance, efficiency, and scalability […]

The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis, where complex structures such as microbumps, redistribution layers (RDLs), and through-silicon vias (TSVs) demand reliable non-destructive testing (NDT). Conventional approaches, including Scanning Acoustic Microscopy (SAM) and X-ray imaging, are limited by noise, resolution, and defect visibility, creating barriers for reproducible […]

Save the Date for the 2025 Open House The Open House event is offers a great opportunity to recognize our member organizations and promote their programs and events, This event features a prominent speaker with a n important technology topic and offers refreshments with networking time for attendees to meet other Silicon Valley engineers. Stay […]

[] This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. Visit our website for details, for our Advance […]

The power industry is under pressure to rapidly expand infrastructure to meet growing demands from both consumers and producers. But sticking to traditional design and construction methods may no longer be enough. One of the biggest bottlenecks? Hardware dependencies—like waiting on control wiring or specific components—that delay commissioning and inflate project timelines. This presentation explores […]

[]Trends in consumer goods are leaning towards thinner, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight, portable, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that […]

[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models […]

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such […]

[] Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically […]